发明名称 Single-Package Bridge-Type Magnetic-Field Angle Sensor
摘要 A single-package bridge-type magnetic-field angle sensor comprising one or more pairs of magnetic tunnel junction sensor chips rotated relative to each other by 90 degrees in order to detect two magnetic field components in orthogonal directions respectively is disclosed. The magnetic-field angle sensor may comprise a pair of MTJ full-bridges or half-bridges interconnected with a semiconductor package lead. The magnetic-field angle sensor can be packaged into various low-cost standard semiconductor packages.
申请公布号 US2013334634(A1) 申请公布日期 2013.12.19
申请号 US201214002738 申请日期 2012.03.02
申请人 DEAK JAMES GEZA;SHEN WEIFENG;ZHANG XIAOJUN;LEI XIAOFENG;JIN INSIK;XUE SONGSHENG 发明人 DEAK JAMES GEZA;SHEN WEIFENG;ZHANG XIAOJUN;LEI XIAOFENG;JIN INSIK;XUE SONGSHENG
分类号 H01L43/02 主分类号 H01L43/02
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