| 摘要 |
PROBLEM TO BE SOLVED: To suppress semiconductor device test cost.SOLUTION: When performing an electric test (S105) of a semiconductor device (2) in a method of manufacturing the semiconductor device, signal output probe needles (25) of a probe card 24 that is mounted on a tester(20) are connected in common to predetermined test terminals (CP1, etc.) in a plurality of units. The method of manufacturing the semiconductor device includes a following step: instructing the semiconductor device to output a signal in parallel to the signal output probe needles (25_1 and 25_7) that share one of the predetermined test terminals (CP1), thereby determining the propriety of the semiconductor device on the basis of a signal voltage of a signal that is input to the predetermined test terminal. |
