| 摘要 |
An apparatus to apply a resin impregnated tape to the surface of a molding tool (60), the apparatus including: an upper frame (12) rotatably mounted to a base frame (14), the upper frame having mounted thereon and rotatable therewith a spool holding assembly (16) for holding a spool of resin impregnated tape wound thereon, a tape compaction assembly (18) including a compaction roller (48) configured to conform to the surface of the molding tool for compacting the resin impregnated tape onto the surface of the molding tool, and a tape tensioning system (38) for exerting tension on the resin impregnated tape. The base frame includes a tracking system (20) for tracking the surface of the molding tool, the base frame being reciprocally movable with respect to the surface of the molding tool. |
