| 摘要 |
The present invention relates to a method of manufacturing an electrically conductive or semiconductive structure on a substrate, electronic devices comprising a substrate and an electrically conductive or semiconductive structure, and uses thereof. The method of manufacturing an electrically conductive or semiconductive structure on a substrate comprises the steps of: applying electrically conductive or semiconductive particles on the substrate; applying at least one cross- linking compound having energetically activatable groups on the substrate; irradiating at least a part of the energetically activatable groups with an energy-carrying activation beam to thereby trigger at least a partial cross-linking of the at least one cross-linking compound so as to obtain an irradiated structure comprising at least partially cross- linked electrically conductive or semiconductive particles; supplying thermal energy for rearranging at least a part of the at least partially cross-linked electrically conductive or semiconductive particles to form a connected electrically conductive or semiconductive structure and for removing at least a part of the cross-linked compound from the substrate. |
