| 摘要 |
The present invention relates to a device for molding an integrated circuit package comprising a lower molding chase, a lower vacuum line, a lower vacuum hole, an upper molding chase, an upper vacuum line, an air vent, and an upper vacuum hole. The lower molding chase has a lower cavity which is filled with an encapsulant. The lower vacuum line is formed in end units of both sides of the lower molding chase outside the lower cavity and provides vacuum pressure inside the lower cavity. The lower vacuum hole is connected to the lower vacuum line. The upper molding chase has an upper cavity corresponding to the lower cavity. The upper vacuum line is formed in end units of both sides of the upper molding chase outside the upper cavity and provides vacuum pressure inside the upper cavity. The air vent is connected to the upper vacuum line and discharges the air from the upper cavity. The upper vacuum hole is connected to the upper vacuum line and the lower vacuum hole. |
