Device and method for testing electronic component elements on a base or substrate

摘要

The handler has a positioning and holding device for the carrier or the substrate (7) and a test head (1). A test socket (3,4) with which electronic component devices on the carrier or the substrate can be contacted simultaneously is connected to the test head. An additional test socket is connected to the test head. An independent claim is also included for a method for testing electronic component devices on a carrier or a substrate.