A three dimensional (3D) stacked chip structure with chips having on-chip heat spreader and method of forming are described. A 3D stacked chip structure comprises a first die having a first substrate with a dielectric layer formed on a front surface. One or more bonding pads and a heat spreader may be simultaneously formed in the dielectric layer. The first die is bonded with corresponding bond pads on a surface of a second die to form a stacked chip structure. Heat generated in the stacked chip structure may be diffused to the edges of the stacked chip structure through the heat spreader.
申请公布号
US8609506(B2)
申请公布日期
2013.12.17
申请号
US201213681152
申请日期
2012.11.19
申请人
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
发明人
LIN CHUAN-YI;HAO CHING-CHEN;CHOU CHEN CHENG;LIN SHENG-YUAN