发明名称 Method of manufacturing a printed circuit board having micro strip line
摘要 A printed circuit board having a micro strip line, a printed circuit board having a strip line and a method of manufacturing thereof are disclosed. The printed circuit board having a micro strip line in accordance with an embodiment of the present invention includes a first insulation layer, a signal line buried in one surface of the first insulation layer, a plurality of conductors penetrating through the first insulation layer and being disposed on both sides of the signal line in parallel with the signal line, and a ground layer formed to be electrically connected to the conductor on the other surface of the first insulation layer.
申请公布号 US8607448(B2) 申请公布日期 2013.12.17
申请号 US201213621122 申请日期 2012.09.15
申请人 KIM HEUNG-KYU;SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM HEUNG-KYU
分类号 H01K3/10 主分类号 H01K3/10
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