发明名称 High-density patterning
摘要 Methods for patterning high-density features are described herein. Embodiments of the present invention provide a method comprising patterning a first subset of a pattern, the first subset configured to form a plurality of lines over the substrate, and patterning a second subset of the pattern, the second subset configured to form a plurality of islands over the substrate, wherein said patterning the first subset and said patterning the second subset comprise at least two separate patterning operations.
申请公布号 US8609528(B1) 申请公布日期 2013.12.17
申请号 US201113204370 申请日期 2011.08.05
申请人 SUTARDJA PANTAS;WU ALBERT;LEE WINSTON;LEE PETER;WEI CHIEN-CHUAN;CHANG RUNZI;MARVELL INTERNATIONAL LTD. 发明人 SUTARDJA PANTAS;WU ALBERT;LEE WINSTON;LEE PETER;WEI CHIEN-CHUAN;CHANG RUNZI
分类号 H01L21/4763 主分类号 H01L21/4763
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