PHOTOSENSITIVE RESIN COMPOSITION COMPRISING ALKALI SOLUBLE RESIN

摘要

The present invention provides a photosensitive resin composition which comprises: (A) (a-1) a constituent unit which is derived from dicarboxylic acid mono[(meth) acryloyl oxyalkyl] ester; (a-2) a constituent unit which is derived from unsaturated carboxylic acid, unsaturated carboxylic acid anhydride, or a constituent unit which is derived from a mixture thereof (but different from (a-1)); (a-3) a constituent unit which is derived from an ethylenically unsaturated compound including one or more selected from epoxy groups or oxetane groups; (a-4) a constituent unit which is derived from aromatic ring contained ethylenically unsaturated compounds; and (a-5) an alkali soluble resin which includes a constituent unit which is derived from an ethylenically unsaturated compound which is different from the (a-1) to (a-4) compounds; (B) polymerizable unsaturated compounds; (C) photopolymerization initiators; (D) silane couplings; and (E) a photosensitive resin composition which includes organic solvents.