| 摘要 |
PROBLEM TO BE SOLVED: To provide an impedance converter which is applicable for high density mounting.SOLUTION: An impedance converter includes: a substrate 1; a signal line 2 formed on the surface of the substrate 1; and a rear face ground 3 formed on the rear face of the substrate 1. By gradually changing the thickness of the substrate 1 along the lengthwise direction of the signal line 2, the rear face ground 3 is inclined with respect to the signal line 2. |
