发明名称 |
SUBSTRATE LOADING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate loading apparatus configured to suppress deformation due to film deposition.SOLUTION: A substrate loading apparatus is configured to load thereon a substrate as a film formation processing object and be stored in a film formation apparatus. The substrate loading apparatus incudes a loading surface defining a loading region configured to load the substrate thereon. An uneven structure is defined on a surface of a deposition region as being at least a residual region of the loading region on the loading surface so that a film deposited on the deposition region is not continuously adhered to the loading surface over the entire surface of the deposition region. |
申请公布号 |
JP2013251370(A) |
申请公布日期 |
2013.12.12 |
申请号 |
JP20120124437 |
申请日期 |
2012.05.31 |
申请人 |
SHIMADZU CORP |
发明人 |
OGISHI ATSUFUMI;SARUWATARI TETSUYA;IMAI DAISUKE;MISHINA TAKESHI |
分类号 |
H01L21/683;C23C16/458;H01L21/31 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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