发明名称 SUBSTRATE LOADING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate loading apparatus configured to suppress deformation due to film deposition.SOLUTION: A substrate loading apparatus is configured to load thereon a substrate as a film formation processing object and be stored in a film formation apparatus. The substrate loading apparatus incudes a loading surface defining a loading region configured to load the substrate thereon. An uneven structure is defined on a surface of a deposition region as being at least a residual region of the loading region on the loading surface so that a film deposited on the deposition region is not continuously adhered to the loading surface over the entire surface of the deposition region.
申请公布号 JP2013251370(A) 申请公布日期 2013.12.12
申请号 JP20120124437 申请日期 2012.05.31
申请人 SHIMADZU CORP 发明人 OGISHI ATSUFUMI;SARUWATARI TETSUYA;IMAI DAISUKE;MISHINA TAKESHI
分类号 H01L21/683;C23C16/458;H01L21/31 主分类号 H01L21/683
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