| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure of temporarily molding a plurality of semiconductor elements and exposing a heat radiation plate from a mold resin with a simple structure and simplifying a manufacturing process thereof.SOLUTION: A middle-side electrode 5 including two semiconductor elements stacked via a mold resin material 10 and configured to connect each electrode is bent inside the mold resin material 10. An electrode connected to a surface opposite to a surface to which each of the semiconductor elements faces when viewed from top in the direction in which the semiconductor elements are stacked is exposed from the mold resin material 10. |
