发明名称 |
THREE DIMENSIONAL PACKAGING FOR MEDICAL IMPLANTS |
摘要 |
Implantable medical devices, and methods of coating same, including a plurality of components disposed on a substrate, and a low surface energy layer deposited as a liquid over at least a first portion of the components and the substrate, the low surface energy layer becoming solidified after deposition and conforming to at least the first portion of the components. The devices further include a biocompatible hermetic coating conforming to and sealingly covering at least a portion of the low surface energy layer. |
申请公布号 |
US2013330498(A1) |
申请公布日期 |
2013.12.12 |
申请号 |
US201213491081 |
申请日期 |
2012.06.07 |
申请人 |
HOGG ANDREAS;TARDY YANIK;AELLEN THIERRY;KEPPNER HERBERT;BURGER JUERGEN;MEDOS INTERNATIONAL SARL |
发明人 |
HOGG ANDREAS;TARDY YANIK;AELLEN THIERRY;KEPPNER HERBERT;BURGER JUERGEN |
分类号 |
B05D3/10;B32B3/08;B32B27/06;B32B27/20 |
主分类号 |
B05D3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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