发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device having a trench gate structure, which can relax stress generated in the trench gate structure.SOLUTION: A semiconductor device comprises trenches 3 each of which includes a first trench 3a having an opening on a surface of a base layer 2, and a second trench 3b which communicates with the first trench 3a, has a clearance between opposite side walls longer than a clearance between opposite side walls of the first trench 3a and has a bottom located in a drift layer 1. The opening is covered with a gate electrode 5. The gate electrode 5 includes a cavity 6 inside. With this configuration, even when use environment changes to have a high temperature and stress occurs due to a difference between a linear expansion coefficient of a gate insulation film 4 and a linear expansion coefficient of the gate electrode 5, the cavity can relax the stress. Accordingly, degradation in characteristics and deterioration in reliability of a trench gate structure can be inhibited.
申请公布号 JP2013251397(A) 申请公布日期 2013.12.12
申请号 JP20120124955 申请日期 2012.05.31
申请人 DENSO CORP 发明人 ARAKAWA KAZUKI;SUMITOMO MASAKIYO;MATSUI MASAKI;HIGUCHI YASUSHI
分类号 H01L29/78;H01L21/28;H01L21/336;H01L29/423;H01L29/49;H01L29/739 主分类号 H01L29/78
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