HEAT TREATMENT DEVICE, COOLING METHOD OF HEAT TREATMENT PLATE, PROGRAM, AND COMPUTER STORAGE MEDIUM

摘要

PROBLEM TO BE SOLVED: To promptly lower a temperature of a heat treatment plate.SOLUTION: A heat treatment device is used for placing a wafer W on a heat treatment plate 50 and performing heat treatment and includes: a second cooling plate 62 which contacts or moves close to the heat treatment plate 50 thereby being used for cooling the heat treatment plate 50; a first cooling plate 61 for cooling the second cooling plate 62; and a cooling plate lifting mechanism 60 for relatively moving the second cooling plate 62 between a standby position for cooling the second cooling plate 62 by the first cooling plate 61 and a cooling position for cooling the heat treatment plate 50. An elastic member 95 is provided between the second cooling plate 62 and the cooling plate lifting mechanism 60.