| 摘要 |
PROBLEM TO BE SOLVED: To obtain a light-emitting element manufacturing method which can inhibit damages on a luminous point when manufacturing a light-emitting element by cutting a semiconductor wafer.SOLUTION: A light-emitting element manufacturing method comprises: cutting a semiconductor wafer 22 after forming one edge along a line of luminous points 30A on the light-emitting element 30 at a prescribed distance from the one edge to form another edge 30C of the light-emitting element 30 separated further from the luminous points 30A in comparison with the one edge 30B. In this way, by isolating the light-emitting elements 30 from the semiconductor wafer 22 after forming the other edge 30C separated further from the line of the luminous points 30A in comparison with the one edge 30B, damages on the luminous points 30A are inhibited because the luminous points 30A are separated from a blade 46 even when the light-emitting element 30 flip-flops on the side to be isolated from the semiconductor wafer 22 when the other edge 30C is formed. |
