发明名称 |
PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE |
摘要 |
An electronic device comprises: a printed wiring board that comprises a substrate, pads formed on the substrate, and an insulating film layer covering a surface of the substrate on which the pads are formed; and an electronic element that comprises external terminals electrically connected to the pads and that is mounted on the printed wiring board. The insulating film layer comprises at least one connecting opening section each exposing at least part of one of the pads. At least part of an inner wall of the connecting opening section comprises at least one step section. |
申请公布号 |
US2013329391(A1) |
申请公布日期 |
2013.12.12 |
申请号 |
US201313963882 |
申请日期 |
2013.08.09 |
申请人 |
ISHIZUKA NAOMI;NEC CORPORATION |
发明人 |
ISHIZUKA NAOMI |
分类号 |
H05K1/02;H05K3/00;H05K13/04 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|