| 摘要 |
The invention relates to soldering materials, in particular fluxes. There is disclosed a reactive flux for soldering aluminum and aluminum alloys without solder additives using distribution medium of potassium fluoroaluminate and fluoride activators. As the distribution medium there is used a fusible mixture of potassium fluoroaluminates and as activators - potassium hexafluorosilicate and aluminum fluoride within the following limits by wt. %: potassium hexafluorosilicate 1.0-50, aluminum fluoride 0.05-20, fusible mixture of potassium fluoroaluminate - the rest. Technical result: creating a flux, which forms a solder on the aluminum surface during soldering an article as a result of aluminothermic reaction. |
