发明名称 COVER TAPE, METHOD FOR MANUFACTURING COVER TAPE, AND ELECTRONIC PART PACKAGE
摘要 <p>A cover tape having a temperature at which a heat shrinkage rate in at least one of a machine direction and a transverse direction perpendicular to the machine direction is 5% or more between 80°C to 200°C.</p>
申请公布号 KR101339583(B1) 申请公布日期 2013.12.10
申请号 KR20127002237 申请日期 2010.08.25
申请人 发明人
分类号 B65D65/40;B65D73/02;B65D85/86 主分类号 B65D65/40
代理机构 代理人
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