发明名称 |
BONDING SYSTEM, BONDING METHOD, PROGRAM AND COMPUTER STORAGE MEDIUM |
摘要 |
PROBLEM TO BE SOLVED: To bond a processed substrate and a support substrate appropriately.SOLUTION: A bonding system 1 for bonding a processed wafer W and a support wafer S includes bonding devices 31-33 for bonding a processed wafer W and a support wafer S via an adhesive, and a heat treatment device 30 performing heat treatment of a superimposed wafer T bonded by the bonding device 31-33 so that the outer peripheral part of the superimposed wafer T is heat treated at a higher temperature than the central part. The heat treatment device 30 has an annular heating mechanism for heating the outer peripheral part of the superimposed wafer T. The heat treatment device 30 can house a plurality of superimposed wafers T and can perform heat treatment thereof. The interior of the heat treatment device 30 can be maintained in inert gas atmosphere. |
申请公布号 |
JP2013247280(A) |
申请公布日期 |
2013.12.09 |
申请号 |
JP20120120902 |
申请日期 |
2012.05.28 |
申请人 |
TOKYO ELECTRON LTD |
发明人 |
DEGUCHI MASATOSHI;HONDA MASARU |
分类号 |
H01L21/02;H01L21/683 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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