| 摘要 |
PROBLEM TO BE SOLVED: To provide a case structure with a high quality and improved reliability of a soldering joint section.SOLUTION: A case structure comprises a metal case 20, and a printed circuit board 30 housed in the metal case 20. The metal case 20 has a side section 22 abutted against the printed circuit board 30, and jointed to the printed circuit board 30 by soldering. The side section 22 includes: a soldering section 23 provided with a solder; a protrusion section 27 projecting from the soldering section 23 and covered with the solder; and an edge 24 arranged around the soldering section 23 and separated from the soldering section 23. A recess 32 in which the protrusion section 27 is positioned is formed on the printed circuit board 30. |
