| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board on which an electronic component can be mounted normally without forming a protrusion consisting of copper plating above a through hole, and other insulation layer and a conductor layer can be laminated normally.SOLUTION: The manufacturing method of a wiring board comprises: a step of preparing a double-sided copper-clad plate 3 where a copper foil 2 is clad to both surfaces of an insulating plate 1; a step of boring a through hole 4 in the double-sided copper-clad plate 3 so as to penetrate the copper foil 2 on both surfaces and the insulating plate 1 therebetween with a first diameter D1; a step of forming a plating resist layer 5 that has an opening 6 of second diameter D2 smaller than the first diameter D1 above the through hole 4 with the periphery of the opening 6 projecting above the through hole 4, on the copper foil 2 having double sides; and a step of depositing a through hole conductor 7 consisting of copper plating on the inner wall of the through hole 4, so that both ends of the through hole conductor 7 do not protrude into the opening 6 of the resist layer 5. |
