| 摘要 |
A method for cutting a toughened glass plate according to the first embodiment of the present invention comprises: a step for scanning a laser beam with the laser beam focused on an intermediate layer and thus forming the first modified region along the first cutting line; and a step for applying an external force to the resulting glass plate to cause crack extension in the thicknesswise direction of the glass plate with the first modified region acting as the starting point, and thereby dividing the glass plate. The method is characterized in that, in the step for forming the first modified region, the thicknesswise width, d1(mm), of the first modified region is adjusted to be less than 2×103×Kc2/{pi ×(CT)2} [wherein Kc (MPa·√m) is the fracture toughness of the glass plate, and CT (MPa) is the tensile stress remaining in the intermediate layer]. |
