| 摘要 |
PROBLEM TO BE SOLVED: To improve operation efficiency of a substrate bonding apparatus without increasing capacity of a power source.SOLUTION: The substrate bonding apparatus which heats and pressurizes a pair of laminated substrates to bond them together includes: a plurality of heating/pressurizing units for heating and pressurizing a plurality of pairs of laminated substrates; and a control unit for controlling power supplied to each of the heating/pressurizing units. The control unit starts power supply to at least one heating/pressurizing unit of the heating/pressurizing units at a time point different from a starting time point of power supply to the other heating/pressurizing units. |
