| 摘要 |
<p>[Problem] To position diaphragms (13a, 13b), which are divided by a slit (17), above a silicon substrate (12). The present invention provides the upper surface of the substrate (12) with a backplate (18) that covers the diaphragms (13a, 13b), and provides the lower surface of the backplate (18) with fixed electrode plates (19a, 19b) which face the diaphragms (13a, 13b). The backplate (18) and the fixed electrode plates (19a, 19b) have acoustic holes (24) formed therein. The backplate (18) is also provided with a backplate slit (34) located directly above the slit (17).</p> |
