| 摘要 |
A semiconductor system (100) comprises a first component including a first semiconductor chip (110) attached to the pad (120) of a leadframe made of a first metal sheet of high thermal conductivity, and a second component including a second semiconductor chip (140) attached to the pad (150) of a leadframe made of a second metal sheet wire-bondable on both surfaces. Wires (160) connect chip (140) to leads (151) at the surface (151a) facing the chip. A polymeric housing (170) encapsulates chip (140) and wires (160), leaving un-encapsulated the lead surface (151b) facing away from chip (140). Housing (170) is attached to the first chip (110) using a layer (180) of low thermal conductivity, and lead surfaces (151 b), facing away from the first chip (110), are connected by wires (131) to leads (121) of the first metal leadframe. |
