发明名称 |
SUBSTRATE PLACING APPARATUS AND SUBSTRATE PLACING METHOD |
摘要 |
<p>The present invention is provided with: a substrate plate having a mounting surface for mounting a substrate thereon; and a substrate mounting apparatus for mounting the substrate on the mounting surface of the substrate plate. The substrate mounting apparatus is provided with: a substrate holding mechanism, which holds the substrate, and which is provided with a substrate heating mechanism for heating the substrate; a substrate moving mechanism, which moves the substrate onto the mounting surface such that the substrate main surface faces the mounting surface, said substrate being held by means of the substrate holding mechanism; and a substrate rotating mechanism, which rotates the substrate on the mounting surface.</p> |
申请公布号 |
WO2013179489(A1) |
申请公布日期 |
2013.12.05 |
申请号 |
WO2012JP64309 |
申请日期 |
2012.06.01 |
申请人 |
SHIMADZU CORPORATION;IMAI, DAISUKE;TAKEDA, NAOYA |
发明人 |
IMAI, DAISUKE;TAKEDA, NAOYA |
分类号 |
H01L21/677;C23C16/46;H01L31/04 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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