| 摘要 |
<p>An electronic component (1) comprising: a wiring substrate (2) having a wiring substrate main body (7) and a pair of end lands for fixing (8c) provided at the end surfaces (7c) of the wiring substrate main body (7), respectively, so as to sandwich the wiring substrate main body (7); and a shield case (3) having a top plate (12) facing a first IC chip-mounting surface (7a) being a surface upon which an IC chip (4) for the wiring substrate (2) is mounted, and a plurality of outside side plates (10) that surround a shield space (G) being a space between the first IC chip-mounting surface (7a) and the top plate (12). The distance (A) between a pair of contact sections (10b) is smaller than the width dimension (c) of the wiring substrate (2) including the pair of end lands for fixing (8c), in a state in which the shield case (3) is removed from the wiring substrate (2).</p> |
