| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for cleaning of substrates used to fabricate devices and electroless deposition of cap layers for integrated circuits.SOLUTION: The method is implemented on a substrate having a surface comprising a metal and dielectric damascene metallization layer. The method comprises steps 110, 130 of exposing the surface of the substrate to a cleaning solution sufficient to clean the surface of the substrate; and a step 150 of exposing the surface of the substrate to an electroless deposition solution sufficient to deposit a cap layer. Also provided are solutions for cleaning the substrate and solutions for accomplishing electroless deposition. |
