| 发明名称 |
SLURRY FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING METHOD |
| 摘要 |
<p>The present invention provides a slurry for chemical mechanical polishing that contains: abrasive grains (a); a compound (b) having an amino group with a pKa value of greater than nine, and three or more hydroxyls; and water.</p> |
| 申请公布号 |
WO2013180079(A1) |
申请公布日期 |
2013.12.05 |
| 申请号 |
WO2013JP64676 |
申请日期 |
2013.05.27 |
| 申请人 |
KURARAY CO., LTD. |
发明人 |
KATO, MITSURU;OKAMOTO, CHIHIRO;KATO, SHINYA |
| 分类号 |
H01L21/304;B24B37/00;C09K3/14 |
主分类号 |
H01L21/304 |
| 代理机构 |
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