| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device which accomplishes the reduction of the number of steps and high productivity, prevents the occurrence of voids, and achieves high reliability.SOLUTION: In a manufacturing method of a semiconductor device, a semiconductor chip having a connection terminal is joined to a substrate having a connection terminal. The manufacturing method of the semiconductor device includes: a temporary fixture step of temporarily fixing the semiconductor chip onto the substrate through an adhesive for a semiconductor sealing material; and an overmolding step of resin-sealing the semiconductor chip on the substrate. In the overmolding step, the joining between the connection terminal of the semiconductor chip and the connection terminal of the substrate and hardening of the adhesive for the semiconductor sealing material are concurrently conducted. |
