发明名称 HEAT-SINK DEVICE INTENDED FOR AT LEAST ONE ELECTRONIC COMPONENT AND CORRESPONDING METHOD
摘要 The present invention relates to a heat-sink device intended for at least one electronic component (12), including: heat-sink means; a substrate (11) for the at least one electronic component (12), said substrate covering the heat-sink means; and thermal coupling means provided between the substrate and the heat-sink means and made from a material different from that of the heat-sink means. According to the invention, the heat-sink means consist of a set of independent fins (10), and the thermal-coupling means (13) are made from a heat-conductive polymer material and also serve as mechanical coupling means between the substrate (11) and the fins (10).
申请公布号 US2013322019(A1) 申请公布日期 2013.12.05
申请号 US201113877752 申请日期 2011.09.27
申请人 GASSE ADRIEN;REVIRAND PASCAL;COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIESALTERNATIVES 发明人 GASSE ADRIEN;REVIRAND PASCAL
分类号 H05K7/20;H05K3/30 主分类号 H05K7/20
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