| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition with improved adhesion property to a substrate without decreasing alkali developability. <P>SOLUTION: This photosensitive resin composition contains: a photosensitive resin with an acid value of 20-140 mgKHO/g having one or more radical polymerizable unsaturated bonds and one or more carboxyl groups in one molecule; a compound having one or more amide groups and one or more hydroxyl groups in one molecule; a photoinitiator; and a coloring agent. <P>COPYRIGHT: (C)2010,JPO&INPIT |
