发明名称 |
LAMINATED CHIP ELECTRONIC COMPONENT, BOARD FOR MOUNTING THE SAME AND PACKING UNIT THEREOF |
摘要 |
A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; first and second external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer; and additional electrode layers disposed irrespective of a formation of capacitance within the lower cover layer. |
申请公布号 |
EP2669914(A1) |
申请公布日期 |
2013.12.04 |
申请号 |
EP20120275123 |
申请日期 |
2012.08.23 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD |
发明人 |
AHN, YOUNG GHYU;PARK, MIN CHEOL;KIM, DOO YOUNG;PARK, SANG SOO |
分类号 |
H01G4/30;B65B9/04;B65B15/04;H01G2/06;H01G4/012;H01G4/12;H05K1/18 |
主分类号 |
H01G4/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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