| 摘要 |
Provided is a semiconductor package including a printed wiring board (101) and a semiconductor chip (102) that has a first signal terminal (103a) and a second signal terminal (103b) and is mounted on the printed wiring board (101). The printed wiring board (101) has a first land (131a) and a second land (131b) for solder joining, which are formed on a surface layer thereof. Further, the printed wiring board (101) has a first wiring (141a) for electrically connecting the first signal terminal (103a) of the semiconductor chip (102) and the first land (131a), and a second wiring (141b) for electrically connecting the second signal terminal (103b) of the semiconductor chip (102) and the second land (131b). The second wiring (141b) is formed so that the wiring length thereof is larger than that of the first wiring (141a). The second land (131b) is formed so that the surface area thereof is larger than that of the first land (131a). This reduces difference in transmission line characteristics due to the difference in wiring length. |
