发明名称 SUBSTRATE WITH THOUGH ELECTRODE AND METHOD FOR PRODUCING SAME
摘要 <p>A method for producing a substrate with through-electrode includes the steps of: forming recesses 21 or through-holes 21B in either one of a silicon substrate 51 and a glass substrate 54; forming protrusions 52 in the other substrate; laying the silicon substrate 51 and glass substrate 54 on each other so that the protrusions 52 are inserted in the respective recesses 21 or through-holes 21B; and bonding the silicon substrate 51 and the glass substrate 54 to each other.</p>
申请公布号 EP2669940(A1) 申请公布日期 2013.12.04
申请号 EP20120739563 申请日期 2012.01.24
申请人 PANASONIC CORPORATION 发明人 HOZUMI, JUNICHI;TAURA, TAKUMI;OKUMURA, SHIN;NAKATANI, TOMOHIRO;TOMOIDA, RYO
分类号 H01L23/02;C03C27/02;G01P15/08;G01P15/125;H01L23/04;H01L23/06;H01L23/14;H01L29/84 主分类号 H01L23/02
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