发明名称 |
SUBSTRATE WITH THOUGH ELECTRODE AND METHOD FOR PRODUCING SAME |
摘要 |
<p>A method for producing a substrate with through-electrode includes the steps of: forming recesses 21 or through-holes 21B in either one of a silicon substrate 51 and a glass substrate 54; forming protrusions 52 in the other substrate; laying the silicon substrate 51 and glass substrate 54 on each other so that the protrusions 52 are inserted in the respective recesses 21 or through-holes 21B; and bonding the silicon substrate 51 and the glass substrate 54 to each other.</p> |
申请公布号 |
EP2669940(A1) |
申请公布日期 |
2013.12.04 |
申请号 |
EP20120739563 |
申请日期 |
2012.01.24 |
申请人 |
PANASONIC CORPORATION |
发明人 |
HOZUMI, JUNICHI;TAURA, TAKUMI;OKUMURA, SHIN;NAKATANI, TOMOHIRO;TOMOIDA, RYO |
分类号 |
H01L23/02;C03C27/02;G01P15/08;G01P15/125;H01L23/04;H01L23/06;H01L23/14;H01L29/84 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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