| 摘要 |
A spark gap device includes an optional insulating layer formed on a substrate, a metal layer formed on a surface of the insulating layer, a solder resist layer formed on a surface of the metal layer, and first and second contacts. The metal layer includes a central portion and a peripheral portion separated by an air gap that surrounds the central portion of the metal layer and exposes the insulating layer. The solder resist layer includes a central portion disposed on the central portion of the metal layer having a first opening exposing a central region of the central portion of the metal layer, and a peripheral portion disposed on the peripheral portion of the metal layer having a second opening exposing a peripheral region of the peripheral portion of the metal layer. The first contact is formed in the first opening and the second contact is formed in the second opening. |
