| 摘要 |
The present invention relates to a depositing apparatus which is used for a deposition method for forming a thin film on a substrate like a wafer. Particularly, the present invention relates to an improved depositing apparatus capable of improving deposition efficiency by including a sealing structure between a gas supply unit and a susceptor which receives the substrate in a track type depositing apparatus, improving a substrate throughput, and reducing gas waste and maintenance/repair costs at the same time. |
