Cooling channels on interface between corundum substrate - 3D LTCC structure

摘要

The invention relates to the implementation of the technology of cooling channels at the interface of alumina substrate - 3D LTCC structure for the heat removal from the 3D LTCC structures by the liquid medium. 3D LTCC structure produced from the LTCC ceramic thickness of 254 um (1) (Figure 1) has in not fired state a surface cavity (2) on the bottom whose size and shape depends on the number and distribution of heating sources. 3D LTCC structure is isostatically laminated and subsequently fired. On the bottom of the 3D structure of the LTCC and on the alumina substrate (3) will be pressed layer (4) using a conductive paste based on Ag and subsequently structure are separately fired in defined temperature profile applied for heat conducting paste. After fire procedure the adhesive paste (5) is pressed on the fired conductive layer of the alumina ceramics 3D LTCC structure and then two layers are mechanically jointed. Joined parts are fired at temperatures of 250 ø C during 20 min., the surface of the cavity 3D LTCC structure are sealed to form the alumina ceramics internal cooling channels for delivery of heat in the coolant connected to the micro pump. The cooling liquid circulates in an internal channel through the micro pump, connected to terminals (6) on the surface of the 3D LTCC structure.