发明名称 METAL PLATE LOW-RESISTANCE CHIP RESISTOR AND METHOD FOR MANUFACTURING SAME
摘要 The present invention includes: a step for readying a low-resistance metal plate (10) having a predetermined width and thickness; a step for applying a sand-blast treatment on the surface of the low-resistance metal plate (10); a step for forming, on each respective center section of the upper and lower surfaces of the low-resistance metal plate (10), a single insulating protective film (11a, 11b) along the length direction of the low-resistance metal plate (10) at a predetermined width; and a step for using electroplating to form, on the low-resistance metal plate (10) on both sides of the insulating protective films (11a, 11b), an electrode layer in which a front electrode (12a), a reverse electrode (12c), and an end-surface electrode (12b) are integrated. Therefore, minute unevenness is generated by the sand-blast treatment on the surface of the low-resistance metal plate (10); and as a result, there is an increase in the strength of adhesion, with respect to the surface of the metal plate (10), of the insulating protective films (11a, 11b) and the electrode layer (12a, 12c, and 12b) that are subsequently formed on the surface of the metal plate (10).
申请公布号 KR20130130809(A) 申请公布日期 2013.12.02
申请号 KR20137021469 申请日期 2012.01.24
申请人 KAMAYA ELECTRIC CO., LTD. 发明人 HIRANO TATSUKI
分类号 H01C3/00;H01C1/01;H01C17/00 主分类号 H01C3/00
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