发明名称 HALOGEN-FREE EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE SEALED USING THE SAME
摘要 PURPOSE: A halogen-free epoxy resin composition comprises excellent flame retardance without emitting harmful material, and to able to improve thermal stability, molding workability, continuous workability and reliability. CONSTITUTION: A halogen-free epoxy resin composition comprises 2-20 weight% of epoxy resin, 60-95 weight% of filler, 0.05-5 weight% of a curing accelerator, and 0.5-15 weight% of a flame retardant, and additionally comprises 0.1-10 weight% of additives. The flame retardant comprises oxide-aluminum hydroxide. The flame retardant comprises 0.5-10 weight% of the oxide-aluminum hydroxide based on total weight of the composition.
申请公布号 KR101334649(B1) 申请公布日期 2013.12.02
申请号 KR20110028017 申请日期 2011.03.29
申请人 发明人
分类号 C08K3/22;C08L63/00;C09K21/02;H01L23/29 主分类号 C08K3/22
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