发明名称 |
ANTENNA IN PACKAGE WITH REDUCED ELECTROMAGNETIC INTERACTION WITH ON CHIP ELEMENTS |
摘要 |
A IC package for a wireless device includes an antenna that is attached to the chip. The electrically conductive elements of the antenna are spaced away from the antenna and particularly the endpoint of the antenna to prevent interference with the antenna. An element on the IC package may he shielded antenna. The antenna may have the shape of a space-filling curve, including a Hilbert, box-counting or grid dimension curve.
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申请公布号 |
US2013313692(A1) |
申请公布日期 |
2013.11.28 |
申请号 |
US201213673750 |
申请日期 |
2012.11.09 |
申请人 |
FRACTUS, S.A.;FRACTUS, S.A. |
发明人 |
SOLER CASTANY JORDI;PUENTE CARLES;MUMBRU FORN JOSE |
分类号 |
H01L23/552;H01L23/48 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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