METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a delamination method which does not damage a release layer, and to release with a good yield the entire layer of not only a release layer with a small area but also a release layer with a large area.SOLUTION: After fixing substrates are pasted, removal of a part of a glass substrate is triggered by scribing or laser irradiation of the glass substrate, and then delamination is started from the removed part. Thereby, the delamination is performed with a good yield. In addition, cracks are prevented by applying a resin to the entire face of a terminal electrode excluding a connection portion but including a periphery.