SURFACE MOUNTABLE SEMICONDUCTOR DEVICE

摘要

The present invention relates to a surface mountable semiconductor device comprising at least one semiconductor element mounted on or integrated in a device substrate (1) having a top surface and a bottom surface. One or several electrical pads(2) of a first height and at least one thermal pad(3) of a second height are arranged at the bottom surface of the device substrate(1). In the proposed surface mountable semiconductor device the height of the thermal pad(3) is larger than the height of the electrical pads(2). This allows the mounting of such a device to an IMS with a locally removed dielectric layer in an easy and reliable manner in order to directly connect the thermal pad with the metallic substrate of the IMS.