ADHESIVE RESIN COMPOSITION AND HOT-MELT ADHESIVE OBTAINED THEREFROM

摘要

Object: To provide adhesive resin compositions improved in heat resistance without deteriorations in adhesive strength and flexibility. Solution: An adhesive resin composition comprises 30 to 98 wt% of an ethylene/vinyl acetate copolymer (a) and 70 to 2 wt% of a propylene resin composition (P) described below (wherein the total of the component (a) and the component (P) is 100 wt%). The propylene resin composition (P) comprises 60 to 0 wt% of a propylene polymer (b) having a melting point of 120 to 170°C and a melt flow rate of 0.1 to 500 g/10 min, and 40 to 100 wt% of a propylene polymer (c) having a melting point of less than 120 °C or showing no melting points and having a melt flow rate of 0.1 to 500 g/10 min (wherein the total of the component (b) and the component (c) is 100 wt%).