FABRICATION METHOD OF SUBSTRATE

摘要

The present invention relates to a method for fabricating a substrate for mounting an electronic device. The method includes a step for forming a protection layer on the surface of the substrate except an edge part; a step for forming an oxide layer on the front surface of the substrate except the protection layer; a step for growing the oxide layer; a step for forming a through hole in a thickness direction by selectively etching the protection layer; a step for removing the oxide layer; and a step for forming an electrode by filling the through hole with a metal. Damage to the substrate for mounting an electronic device in a manufacturing process is reduced and the cost of production is saved.