Method for wafer alignment using X-ray inspection

摘要

PURPOSE: A method for aligning a wafer using X-ray inspection is provided to simplify a process by using an align key fabricated by a wafer fabrication process. CONSTITUTION: A substrate for wafer fabrication is prepared(S100). The substrate is put into semiconductor device fabrication equipment(S110). X-ray is irradiated to an align key of the substrate in the semiconductor device fabrication equipment(S120). An X-ray detection part confirms the state of the align key(S130). The substrate is aligned by using the information conformed by the X-ray detection part(S140). [Reference numerals] (AA) Start; (BB) End; (S100) Preparing a substrate to be arranged; (S110) Inputting the substrate to semiconductor device fabrication equipment; (S120) Irradiating X-ray to an align key of the substrate; (S130) Confirming the state of the align key in an X-ray detection unit; (S140) Performing the arrangement of the substrate;