| 摘要 |
PURPOSE: A fan-in type semiconductor package is provided to expand the space for a redistribution path by improving the stack structure of a passivation layer. CONSTITUTION: A first passivation layer (18) is coated on a die passivation layer. A die passivation is formed in a semiconductor chip. A redistribution layer (16) is plated on the first passivation layer. A second passivation layer (20) is coated on the first passivation layer. A second passivation layer is coated on the surface of the redistribution layer. |
