发明名称 |
SOLDER BALL SUPPLYING APPARATUS |
摘要 |
Disclosed herein is a solder ball supplying apparatus including: a cartridge formed in a box shape and having a plurality of solder balls embedded therein; a vibration unit coupled to a lower portion of the cartridge; and a metal mask coupled integrally with a lower portion of the vibration unit and having a plurality of holes formed over the entire surface thereof. |
申请公布号 |
US2013306709(A1) |
申请公布日期 |
2013.11.21 |
申请号 |
US201313894312 |
申请日期 |
2013.05.14 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
OH HUENG JAE;YOU YON HO;CHOI JIN WON |
分类号 |
B23K3/06 |
主分类号 |
B23K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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